STMicroelectronics and NUS have officially launched the ST–NUS HELIX Corporate Lab in Singapore. The four-year initiative will advance next-generation edge AI technologies. STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader, has joined NUS for the initiative. The National University of Singapore will host the programme across key research areas.
HELIX stands for Hardware for Embodied Low-power Intelligent Xcceleration. The Corporate Lab will explore new generative and embodied AI applications at the edge. The programme will focus on system-to-silicon innovation. It will also connect research across artificial intelligence, semiconductor design, and hardware development.
The Corporate Lab operates under the Research, Innovation and Enterprise 2025 plan (RIE2025). NUS will host the initiative through the College of Design and Engineering. The School of Computing will also participate in the programme. Together, the institutions will create a multidisciplinary research ecosystem.
The research will cover AI algorithms and accelerator architectures. It will also address low-power memory systems and circuit design. In addition, researchers will examine silicon technologies and application development. The programme will combine NUS research with ST’s semiconductor expertise.
It will also draw on ST’s system development capabilities and industry experience. Consequently, the partnership aims to accelerate practical innovation in edge AI.
NUS President Professor Tan Eng Chye said: “The ST–NUS HELIX Corporate Lab is a testament to the value of industry–academia partnerships in translating research into innovation. By combining NUS’ research strengths with STMicroelectronics’ industrial capabilities, we are building not only advanced, cutting-edge edge AI hardware, but also the talent and ecosystem that will help define the future of Singapore’s semiconductor and AI industries.”
Laurent Malier, Executive Vice President, Global Technology R&D at STMicroelectronics, said: “ST’s strength as an integrated device manufacturer lies in our ability to bring together advanced silicon technologies, embedded memory, circuit design, heterogeneous integration and chiplets. Through HELIX, we are creating an industrially relevant foundation to explore differentiated AI computing technologies and accelerate the translation of promising research into scalable semiconductor solutions.”
Ms Low Yen Ling, Senior Minister of State, officially launched the Corporate Lab. She serves in the Ministry of Culture, Community and Youth. She also serves in the Ministry of Trade and Industry. She attended the launch as the Guest-of-Honour.
HELIX Targets the Next Generation of Edge AI
Edge AI processes information directly on devices or near them. Therefore, these systems do not depend entirely on remote cloud infrastructure. This approach can deliver faster response times and stronger data privacy. It can also improve energy efficiency and resilience.
These advantages matter for systems that must operate in real time. Such systems need to perceive, reason, and act within physical environments. The industry increasingly describes these applications as Physical AI. HELIX will focus on embodied AI as an important area within this field.
Embodied AI places intelligence directly into physical systems. These systems can include robots, humanoids, and drones. Such devices combine multimodal sensing with on-device computing. They also require real-time actuation to respond to their surroundings. However, delivering advanced intelligence on compact hardware presents significant challenges. Devices often operate with strict power and space limitations.
HELIX will address these requirements through research across multiple technology layers. The work will include algorithms, software, system architecture, and hardware. The initiative builds on ST’s long-standing work in artificial intelligence. It will explore system-level solutions for future intelligent devices. These solutions will combine efficient computing with advanced memory architecture. They will also use application-driven design to address emerging device requirements.
Meanwhile, STMicroelectronics and NUS contributes expertise across several technical disciplines. These include integrated circuits, computer architecture, AI models, and system design. Researchers from both organizations will work together under the partnership. Their activities will cover research work packages, talent development, and IP creation. They will also conduct demonstration activities to validate new technology concepts.
Semiconductor Innovation Across the Full Technology Stack
HELIX research will span the complete technology stack. The programme will begin with AI models and system architecture. It will then extend into heterogeneous accelerators and on-chip memory hierarchies. Researchers will also examine circuit design, chip integration, and silicon implementation.
The programme will focus strongly on memory-centric architecture. It will also explore innovative in-memory computing approaches. Furthermore, researchers will develop scalable compute-and-memory systems. These efforts will use ST’s P18 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology. The research will also leverage embedded Phase Change Memory (PCM). P18 FD-SOI supports ultra-low-power operation and adaptive body-biasing.
Embedded PCM provides dense, non-volatile storage on the same die. It operates alongside the on-chip SRAM hierarchy. Together, these technologies can reduce off-chip data movement. That movement can account for significant energy consumption in memory-bound AI workloads.
ST will provide a substantial technology and engineering contribution to HELIX. The company will provide STMicroelectronics and NUS with a dedicated design chassis. The chassis will use ST’s proprietary P18 18nm FD-SOI technology. It will combine silicon, architecture, integration, and engineering capabilities. This industrial-grade foundation will support new AI accelerator concepts. Researchers can use it to develop, integrate, and validate those concepts.
The platform will also reduce the need to build infrastructure from scratch. As a result, researchers can focus more directly on differentiated innovation. The approach can accelerate system-level validation and shorten development cycles. It can also create a clearer path toward industrialization. By combining AI algorithms, accelerator architectures, and memory systems, HELIX targets major edge AI challenges. The programme will also address circuit and semiconductor technology requirements.
These efforts will focus on energy efficiency, memory bandwidth, and latency. They will also address scalability and integration challenges.
Developing Singapore’s Semiconductor and AI Talent
The launch of HELIX represents a strategic investment in Singapore’s technology ecosystem. The programme will strengthen capabilities in edge AI and advanced semiconductor systems. It will also promote industry-relevant research and development. Consequently, the initiative can help develop future specialists in AI systems and chip design. Students, researchers, and professionals will participate in HELIX projects. They will gain practical experience with emerging semiconductor and AI technologies.
Participants will also collaborate with industry leaders during research activities. In addition, they will develop skills aligned with the sector’s changing requirements.
Through these initiatives, HELIX aims to establish a stronger talent pipeline. The programme also seeks to strengthen Singapore’s position in advanced technology. Ultimately, STMicroelectronics and NUS aim to advance innovation in edge AI and semiconductor technologies. The partnership combines academic research with industrial semiconductor capabilities.
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News Source: GlobeNewswire.com
