Intel Foundry and ASML showcased major progress this week at the SPIE Photomask Technology and Extreme Ultraviolet Lithography conference. The event, held in Monterey, California, focused on High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography. Both companies emphasized how High NA EUV technology continues moving toward broader industry readiness. Furthermore, they outlined key milestones achieved through their ongoing collaboration.
Currently, Intel Foundry uses High NA EUV in high-volume manufacturing. As a result, the company has processed more than one million wafers to date. This includes early tool certification, extensive testing, and research efforts. Additionally, volume production now covers select layers for specific Intel Core Ultra Series 3 processors, code-named Panther Lake. Consequently, overlay, throughput, and availability metrics are meeting Intel Foundry’s expectations.
Meanwhile, products built on Intel 18A using High NA EUV for select layers continue performing well. In fact, these products meet or exceed benchmarks set by layers patterned using the NXE platform. Therefore, this progress highlights the technology’s growing reliability in production settings.
Mask Format Flexibility Drives Customer Benefits
Notably, customers can already benefit from High NA EUV using today’s standard mask format. They can achieve this through floor-planning within the 6-inch mask. Alternatively, Intel Foundry’s stitching capabilities and process design kit solutions offer another pathway. For over three years, Intel Foundry has championed the large mask format initiative. Through this effort, the company has worked alongside ASML, mask makers, automation suppliers, and EDA partners.
“Intel Foundry has been one of the key leaders of the industry’s adoption of High NA, from installing the first commercial EXE system in 2024, to qualifying the latest generation of tools, to shipping the first high-volume logic product manufactured with High NA,” said Christophe Fouquet, president and CEO, ASML. “ASML recognizes Intel Foundry’s pioneering role in High NA and its innovations to deliver value today with 6-inch masks, as well as its long-time support of the 6×12-inch mask evolution.”
“The companies building the increasingly complex AI products of the future need manufacturing innovations that are production-ready and easy to use,” said Naga Chandrasekaran, Intel Executive Vice President and Co-General Manager of Intel Foundry. “Within our lithography capabilities, Intel Foundry is focused on near term enablement of High NA on 6-inch masks with or without stitching, and making the transition to 6×12-inch masks. We will continue to work closely with ASML and the entire industry to enable this transition.”
Conference Presentations Highlight Stitching Techniques
Both companies also presented insights on reticle stitching this week. This technique allows designers to use High NA EUV lithography with standard 6-inch masks. ASML’s Jan van Schoot presented scanner and mask requirements for half field stitching. Following that, Intel Foundry’s Kimberly Pierce discussed High NA EUV stitching for manufacturing applications. Ultimately, these sessions reinforced both companies’ commitment to advancing semiconductor manufacturing standards industry-wide.
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News Source: Businesswire.com
