Agentic AI workflows continue to transform electronic design automation: Siemens expands strategic partnership with NVIDIA. The partnership delivers agentic AI workflows that provide semiconductor and PCB engineering teams with trusted, self-verifying engineering processes. These new agentic AI workflows from Siemens combine Siemens’ electronic design automation (EDA) expertise with NVIDIA AI technologies to accelerate engineering productivity, design quality and validation on complex development projects.
The latest upgrade is based on Siemens’ newly launched Fuse™ EDA AI Agent system. The solution now combines advanced NVIDIA AI infrastructure and software. Hence, engineering teams can deploy long-running AI agents that reason, execute engineering tasks, and continuously validate every decision using deterministic physics-based EDA software.
The new platform enables organizations to achieve better result quality while reducing engineering turnaround time. Additionally, it increases the reliability of tool-calling and improves token efficiency in difficult engineering workloads. Siemens also integrated the Fuse EDA AI Agent in its new Intelligence Center X, allowing for enterprise-wide AI agent development, orchestration and collaboration across design, manufacturing and supply chain operations.
Siemens strengthens trusted AI throughout the EDA lifecycle
Intelligence Center X offers AI-based coordination across industrial operations and supports Siemens’ comprehensive Digital Twin strategy. As a result, organizations gain greater visibility, better execution, and more predictable engineering results in their product development efforts.
“Our expanded collaboration with NVIDIA enhances our domain-specific industrial AI, physics-based EDA engines and accelerated computing to create trusted, self-verifying AI workflows,” said Amit Gupta, senior vice president and chief AI strategy officer, Siemens EDA, Siemens Digital Industries Software. “By enabling autonomous and long-running EDA AI agents to continuously validate their decisions against proven engineering tools accurately and efficiently, we help customers accelerate development, improve design quality and increase confidence in trusted engineering outcomes.”
Likewise, NVIDIA emphasized the growing importance of trusted AI in semiconductor engineering.
“Semiconductor and PCB design are among the most complex engineering challenges in the world, and AI agents need trusted tools to reason, act and verify their work,” said Timothy Costa, vice president and general manager of computational engineering at NVIDIA. “Siemens is combining its EDA software with NVIDIA accelerated computing, AI software and Nemotron open models to create self-verifying agentic workflows that improve design quality, speed up results and give engineering teams greater confidence in every step of the process.”
The solution merges Siemens’ engineering intelligence with NVIDIA AI infrastructure to provide complex semiconductor design capabilities faster and more accurately. Optimized EDA agents with the open NVIDIA NeMo Gym library improve quality of results, speed of execution and token efficiency. Moreover, these self-verifying agents have the ability to learn continuously from past engineering projects, allowing for smarter workflow optimization and better design execution as time goes on.
Semiconductor and PCB design enhanced by new AI capabilities
The platform also features the NVIDIA OpenShell secure runtime, enabling enterprise engineering teams to securely deploy autonomous agents across their full EDA environments. It provides a secure foundation for AI-driven engineering workflows. In the meantime, advanced reasoning powered by NVIDIA’s Nemotron models and Switchyard enables AI agents to understand complex engineering trade-offs. It also improves performance and computational efficiency.
Also, NVIDIA accelerated computing and the CUDA-X libraries dramatically reduce the time to run engineering. Now, design teams can get sign-off quality results in hours, not days, while still maintaining engineering accuracy.
Together, these capabilities enable secure multi-agent collaboration, real-time engineering feedback and better convergence across semiconductor and PCB verification workflows. Thus, organizations can achieve more reliable engineering results throughout the product lifecycle.
The Fuse EDA AI Agent additionally manages workflows through synthesis, verification, implementation, and validation processes. Domain-specific AI agents work together through different engineering phases to optimize the end-to-end development of semiconductors and PCBs.
The new offering adds to Siemens’ broad EDA portfolio that includes Catapult, Questa One, Veloce, Solido, Aprisa, Calibre, Tessent, Innovator3D IC and Xpedition technologies. This provides customers with complete support for semiconductor and electronics design.
Agentic AI enhances custom IC design and verification
The expanded partnership also introduces new agentic AI capabilities within Siemens’ Solido Characterization Suite. These workflows automate library characterization by generating and verifying Liberty files using Solido Characterizer, Solido LibSPICE, Solido Generator, and Solido Analytics. They streamline the characterization process while maintaining accuracy and consistency. As a result, engineering teams can reduce characterization turnaround times by more than ten times. They also lower token costs by five to ten times.
The capabilities further extend into custom integrated circuit design through the new Solido Layout Analyzer. The AI-powered solution allows engineers to analyze parasitic effects and layout-dependent behavior using natural language prompts. Furthermore, it provides result analysis, design recommendations, and automated report generation to improve engineering productivity.
“For STMicroelectronics’ non-volatile memory team, the ability to relate layout insight directly to electrical behavior is critical. Rather than discovering layout dependent effects late in the process, Solido Layout Analyzer brings this analysis earlier into the flow, improving design confidence and helping cut down the time we spend debugging complex design blocks by weeks. We are planning to test and validate the advantages in our on-going design activity,” said Gianbattista Lo Giudice, Non-Volatile Memory Design manager, STMicroelectronics.
Verification continues to consume nearly 70 percent of semiconductor development time. Therefore, Siemens has expanded the recently introduced Questa One Agentic Toolkit with NVIDIA’s Nemotron 3 Ultra reasoning model. The enhanced solution enables AI agents to evaluate engineering trade-offs, continuously validate designs against golden test harnesses, identify issues earlier, and accelerate verification closure.
“We’re at an inflection point where the complexity of AI chips, chiplets, and 3D ICs has outpaced traditional verification methodologies,” said Abhi Kolpekwar, senior vice president and general manager Digital Verification Technologies, Siemens EDA, Siemens Digital Industries Software, “agentic AI is the natural path forward that scales with this complexity—agents that can orchestrate multi-domain verification, reason across billions of test scenarios, and deliver production-quality results in timeframes that were impossible just two years ago.”
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News Source: PRNewswire.com
