NXP Semiconductors has announced a new applications processor called the NXP i.MX 93W to accelerate the global rollout of Physical AI. This new SoC solution is a first-to-market product for the industry, featuring a dedicated NPU and secure tri-radio wireless connectivity. The company has achieved this by integrating these functionalities into a single chip. Thus reducing the number of components used in a system by up to 60.
“With the i.MX 93W, we’re extending the i.MX 9 family to help customers scale physical AI faster,” said Charles Dachs, Executive Vice President and General Manager, Secure Connected Edge at NXP Semiconductors. “This new platform simplifies integration of AI and secure wireless connectivity, reducing design complexity and allowing customers to more quickly deploy AI agents at the edge.”
Integrated Compute, Security, and Connectivity for Physical AI
The i.MX 93W application processor includes a dedicated AI NPU and secure tri-radio wireless connectivity in a single solution, removing the need for up to 60 discrete parts and reducing system complexity and cost. The i.MX 93W application processor includes a dual-core Arm® Cortex®A55 processor and an Arm Ethos NPU, which can deliver up to 1.8 eTOPs of AI performance. The processor includes the IW610 tri-radio solution for Wi-Fi 6, Bluetooth Low Energy, and 802.15.4 connectivity for Matter and Thread devices, helping simplify development and speed time-to-market.
The i.MX 93W SoC includes the EdgeLock Secure Enclave (Advanced Profile), which supports regulatory mandates like the European Cyber Resilience Act (CRA). The EdgeLock Secure Enclave is a hardware root of trust for secure boot, secure updates, device authentication, and secure access to the device. NXP is offering pre-certified reference designs with single and dual antenna configurations, which can help simplify RF integration and reduce the overall certification burden for customers.
“The new i.MX 93W SoC is an exciting addition to the i.MX portfolio, combining powerful application processing, integrated AI acceleration, and secure wireless connectivity in a highly compact SiP architecture,” said Andreas Kopietz.“For embedded developers, the combination of the i.MX 93 applications processor with integrated Wi-Fi® 6, Bluetooth® LE, Thread, and Zigbee significantly simplifies system design and certification. This allows our customers to reduce development effort, lower certification costs, and accelerate time-to-market for connected HMI, industrial, and IoT devices.”
“As smart IoT gateways and edge-connected devices continue to scale, developers need production-ready platforms with strong wireless performance, security, and power efficiency,” said Ahmed Shameem, Associate Director of System on Modules at iWave. “By offering the i.MX 93W, as a fully integrated System on Module with built-in Wi-Fi 6 tri-radio connectivity, we are helping to simplify design, reduce development risk, and accelerate time-to-market for next-generation industrial and smart IoT products and applications.”
“Vantron is proud to collaborate closely with NXP to bring advanced embedded intelligence to industrial automation,” said Bo Wei, CEO at Vantron Technology.
“As a highly integrated SiP platform combining application processing and Wi-Fi connectivity, i.MX 93W simplifies system design and reduces development and certification efforts. This integration enables our customers to accelerate time-to-market, optimize overall system cost, and deploy robust, secure solutions for the demanding environments of machinery manufacturing, while ensuring long-term operational reliability.”
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News Source: GlobeNewswire.com
