Semtech Corporation has announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA). This industry initiative aims to enable high-bandwidth AI optical interconnects for AI network infrastructure.
Semtech provides high-performance semiconductors for AI data center networking. Its chips also power intelligent, connected Internet of Things (“IoT”) devices worldwide. Now, the company serves as a technology partner to the MSA. It offers a broad portfolio of 200G/lane modulator driver and transimpedance amplifier (TIA) integrated circuits. These products support XPO transceiver development and volume deployment.
AI infrastructure buildouts continue to demand higher network throughput and bandwidth density at lower power. As a result, AI optical interconnects the industry is moving toward new transceiver form factors that can meet these requirements at scale. XPO answers these demands with a groundbreaking pluggable optical transceiver form factor. Notably, it delivers industry-leading faceplate density.
Market analysts also expect a rapid shift in the optics segment.
“AI requires datacom optics with the highest performance, speed and density, and the market is poised to rapidly shift to 200G/lane electrical solutions this year,” said Scott Wilkinson, lead analyst for optical components at Cignal AI. “As AI operators transition to these high-speed optics, demand will continue to rapidly expand from $9 billion at the start of the AI revolution in 2024 to an estimated $37 billion in 2026.”
Semtech’s own leadership shares this optimism about the XPO approach.
“XPO represents an innovative and practical approach to addressing network density challenges while preserving the field-serviceability and configurability benefits of pluggable optics,” said Scott Schube, vice president of applications engineering and product definition at Semtech. “Semtech’s portfolio of high-performance modulator drivers and TIAs is designed to support the XPO ecosystem from early prototyping through volume deployment.”
Semtech’s 200G/lane Optical IC Portfolio for XPO
Semtech supplies a broad portfolio of high-performance linear modulator AI optical interconnects driver and TIA ICs. These devices deliver low power, ultra-low latency, and high density. Moreover, they target XPO transceiver applications directly.
Semtech’s XPO product family includes:
- GN1834L and GN1834DL quad TIAs with 750mm channel pitch
- GN1838L and GN1838DL octal TIAs with 500mm channel pitch
- GN42T380 octal TIA with 375mm channel pitch
- TN1877 quad and TN1887 octal Mach-Zehnder Modulator (MZM) drivers with 625mm channel pitch
- GN42M380 octal MZM driver with 375mm channel pitch
Key Capabilities of the XPO Product Family
The family also brings several capabilities that support next-generation AI optical interconnects:
- Multiple configurations give module and PIC designers maximum flexibility.
- High linearity ensures the best link integrity.
- On-chip equalization optimizes performance across different electrical PCB and optical channels. In addition, it allows the use of different optics.
- Integrated telemetry features speed up time-to-market and support link analysis and tuning.
- Ultra-low latency suits high-density AI network switch and fabric applications.
- High integration enables compact transceiver designs that meet XPO form factor requirements.
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News Source: Businesswire.com
