AuraStack AI Super Agent marks Cadence’s latest innovation in electronic system design. The company introduced the AuraStack AI Super Agent on Cadence® Allegro® AI Studio, making it the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design. The AuraStack AI Super Agent enables engineering teams to move from system planning to final product development within a single AI-native environment. Moreover, the platform leverages NVIDIA Blackwell and NVIDIA CUDA-X technologies to accelerate complex design workflows.
The new platform coordinates specialized AI agents across planning, implementation, and integrated multiphysics analysis. As a result, designers can shorten the complete system design cycle while improving engineering productivity. Furthermore, Cadence has expanded its AI portfolio by adding AuraStack alongside its ChipStack™, InnoStack™, and ViraStack™ AI Super Agents. Consequently, the company now provides agentic AI capabilities across the complete electronic system design process.
“The next era of AI infrastructure—spanning data centers, automotive, aerospace and physical AI—will be defined not only by silicon, but by the systems that connect, power and cool it,” said Michael Jackson, corporate vice president of R&D for System Design and Analysis at Cadence. “As hyperscale data centers deploy massive AI clusters and other industries advance increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA tools, enables customers to move from manual iteration to intelligent, automated design realization.”
Agentic AI Enhances PCB and Advanced Packaging Workflows
The AuraStack AI Super Agent builds on the architecture behind Cadence’s ChipStack AI Super Agent. It combines agentic AI with simulation and optimization technologies to automate design exploration, realization, and signoff. Additionally, the platform understands design intent through a structured AI model, allowing engineers to streamline development with greater accuracy.
The solution also integrates automation for system planning, constraint management, physical structure definition, IP creation and reuse, place and route, design for manufacturability, and multiphysics analysis. Meanwhile, it establishes a unified AI-driven foundation that models electrical, thermal, and mechanical behavior simultaneously. Therefore, engineering teams can evaluate tradeoffs earlier while improving product optimization throughout development.
Continuous multiphysics feedback enables real-time design convergence. Consequently, engineers can reduce unexpected design issues, improve system reliability, and minimize expensive redesigns before manufacturing begins. Key advantages of the AuraStack AI Super Agent include doubling time-to-market performance, delivering up to 15X productivity improvements, supporting early multiphysics co-optimization, reducing costly respins, and enabling product-level optimization across advanced packaging workflows.
Industry Leaders Expand AI-Powered Engineering Collaboration
Cadence continues collaborating with major technology companies to apply AuraStack AI Super Agent to real-world semiconductor and PCB design challenges.
NVIDIA is using Cadence technologies to automate increasingly sophisticated engineering workflows.
“The scale and complexity of modern AI infrastructure demands a new design approach,” said Tim Costa, vice president and general manager of computational engineering at NVIDIA. “NVIDIA’s collaboration with Cadence is advancing AI-powered engineering workflows that accelerate design convergence and innovation across the industry. The Cadence AuraStack AI Super Agent and the Millennium M2000 Supercomputer deliver up to 20X faster multiphysics performance, giving our engineers the capability to tackle the most demanding design challenges and bring the next generation of AI infrastructure to life.”
Cadence also continues working with TSMC to accelerate advanced package implementation through AI-powered automation.
“As advanced packaging complexity grows, customers need new levels of automation to achieve timely design convergence,” said Aveek Sarkar, director of the Ecosystem and Alliance Management Division at TSMC. “Our long-standing partnership with Open Innovation Platform® (OIP) ecosystem partners like Cadence to deliver advanced package design and verification solutions for TSMC 3DFabric® technologies helps customers accelerate the realization of next-generation multi-die systems for AI and high-performance computing applications. Through our multi-year collaboration on substrate auto routing, we are already enabling customers to boost productivity by 100X while delivering quality of results similar to manual routing.”
Socionext, FORVIA HELLA, and Schneider Electric are also adopting Cadence AI technologies to automate package and PCB design, improve engineering efficiency, accelerate design convergence, and enable engineers to focus on higher-value innovation while reducing repetitive manual work.
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News Source: Businesswire.com
