GigaDevice, a key semiconductor company, introduced its new generation of GD25NX series xSPI NOR Flash, a high-performance memory. This new product features an innovative Dual-Voltage Design. It uses a 1.8 V core and a 1.2 V I/O interface. As a result, this design connects directly to 1.2 V system-on-chip (SoCs). This eliminates the requirement for an external booster circuit. This immediately reduces system power consumption greatly. Moreover, it lowers the final Bill of Materials (BOM) cost. The GD25NX series builds on GigaDevice’s past success. It extends their expertise in dual-voltage Flash design.
The new p roduct delivers high-speed data transfer performance. It also offers outstanding reliability for all users. The GD25NX series is ideal for many demanding applications. These incl ude wearables and large data centers. They also target edge AI and complex automotive electronics. These markets require strong stability and responsiveness. They also need exceptional power efficiency. Specifically, the device achieves very low read currents. This is as low as 16 mA in Octal I/O STR mode. Consequently, it cuts the read power consumption by up to 50%. This comparison is against conventional 1.8 V Flash devices.
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Speed Data Integrity
The GD25NX xSPI NOR Flash supports an octal SPI interface. It reaches a maximum clock frequency of 200 MHz. This speed is supported in both STR and DTR modes. This delivers high data throughput up to 400 MB/s. It offers a typical page program time of only 0.12 ms. Furthermore
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News Source: Businesswire.com