KIOXIA has launched the
Gen
The new SSDs integrate 32-die stacks of 2Tb BiCS FLASH™ QLC 3D flash memory, enhanced with CBA (CMOS directly Bonded to Array) technology. This allows for 8TB per compact 154 BGA package, another first for the industry. Thanks to KIOXIA’s advanced wafer and bonding technologies, the drives achieve unp
These SSDs are ideal for data lakes where high-volume data ingestion and real-time processing are essential. Traditional HDDs can slow performance a nd waste GPU power. In contrast, KIOXIA’s 245.76TB SSD offers better capacity per watt, fewer drive bays, and reduced energy consumption—improving total cost of ownership (TCO).
Key Features of KIOXIA LC9 Series SSDs Include:
- Up to 245.76TB in 2.5-inch and E3.L form factors
- 122.88TB variant in E3.S format
- PCIe® 5.0 interface with speeds up to 128GT/s
- NVMe™ 2.0 and NVMe-MI™ 1.2c compliance
- Support for Open Compute Project Datacenter NVMe™ v2.5
- Flexible Data Placement (FDP) to reduce write amplification
- Security options: SIE, SED, FIPS-compliant SED
- CNSA 2.0-compliant digital signature algorithm for post-quantum security
KIOXIA’s LC9 SSDs significantly reduce energy use and enhance cooling, two major factors for data center efficiency. By consolidating storage into a sma ller footprint, these drives help data centers handle next-gen AI workloads without hardware bottlenecks.
Currently, KIOXIA is sampling the LC9 SSDs with select customers. The drives will also be showcased at the Future of Memory and Storage 2025 event in Santa Clara from August 5-7.
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News Source: Businesswire.com